Manual/Spec Sheet

These solders are specially formulated to be used with gold and silver plated contacts to prevent the leaching of precious metals which is easily dissolved into tin. Leaching is the tendency for tin/ lead-bearing solder to dissolve metalizations during reflow operations. The rate at which silver leaches into molten tin/ lead solder alloy is retarded by using solder alloys which contain a small amount of silver. These solders contain 2% silver in the alloy.

Similar to:
NTE/Kester 83-7145-0415

Additional Model #'s
264-50-6200
264-506200
50-6200
506200

UPC: None